Fueled by rapid advances in AI, High-Performance Computing (HPC), Chiplet and advanced packaging technologies, coupled with the commercialization of glass substrate packaging spearheaded by Intel and other manufacturers, the semiconductor industry is rapidly moving toward higher integration, larger panel formats and lower manufacturing costs. As a key pathway for advanced packaging, Panel-Level Packaging (PLP) has emerged as a major industry focus, benefiting from its larger processing area, improved material utilization and superior scalability for mass production.

Nevertheless, while boosting production efficiency and cutting manufacturing costs, PLP imposes stricter requirements on the deposition precision of critical functional films. Achieving high-uniformity, high-efficiency functional film coating on large-format substrates has become a major bottleneck hindering the industrialization of PLP.

To address these challenges, MANST has launched a slot-die flatbed coating system solution, building a full-spectrum technical service system covering core components, complete equipment, whole-line integration, process development and material validation, to support mass production of panel-level packaging.

Uniform Coating: Resolve Consistency Issues on Large-Size Substrates

As processing dimensions expand in panel-level packaging, coating defects such as uneven flow distribution, edge buildup and film thickness variation frequently occur. Leveraging self-developed high-precision coating dies, precision liquid supply systems and motion control platforms, MANST’s slot-die flatbed coating system delivers film thickness uniformity ≤3% within the effective coating area, with an effective coverage ratio above 95%. It minimizes defects including thickness deviation and pinholes at the source, ensures excellent uniformity and barrier performance of dielectric layers, lays a solid process foundation for fine patterning of Redistribution Layers (RDL), and improves packaging yield and long-term reliability.

Precision Regulation: Adapt to Complex Processes with Multiple Materials

Panel-level packaging involves various functional materials with vastly different viscosity, rheological properties and process windows. Insufficient liquid feeding precision or unstable parameter control tends to trigger film thickness fluctuation, material waste and even process failure, undermining product consistency.

MANST’s self-developed high-precision dispensing pump features a control resolution of 0.01 μL/s and a response time of only 0.01 s, enabling precise regulation of submicron-level film thickness. Paired with proprietary whole-line control software and closed-loop algorithms, it dynamically adjusts key parameters including flow rate, coating speed and die gap to accommodate differentiated requirements of multi-layer processes.

Mass Production Deployment: Establish Scalable Manufacturing Capacity

Tailored for volume production demands, MANST has built an integrated flatbed coating platform spanning process development to large-scale manufacturing. Adopting a modular design, the coating die supports a maximum coating width of 4000 mm, enabling one-step uniform coating on large substrates. It is compatible with standard panel sizes ranging from 300×300 mm to 800×800 mm, as well as customized specifications. Furthermore, equipped with shock-absorbing structures and proprietary warpage control processes, the system preserves coating uniformity while mitigating risks of chip offset, edge chipping and cracking, delivering robust assurance for PLP mass production.

One Technology Platform, Covering Diverse Application Scenarios

Beyond advanced panel-level packaging, MANST’s flatbed coating technology can be deployed across other advanced manufacturing sectors requiring large-area, highly uniform functional thin films.

In perovskite solar energy, MANST’s GW-scale flatbed coating platforms have been deployed for large-format module production, accumulating rich experience in continuous large-area coating. In advanced display, demand for highly uniform functional film deposition keeps rising for Mini LED, Micro LED and other emerging display technologies, where precision flatbed coating demonstrates broad application prospects.

From advanced panel-level packaging to perovskite solar cells and new-type display panels, different industries, despite adopting different material systems and process routes, all share a common demand for large-area, highly uniform, and continuous manufacturing.

Going forward, MANST will continue to deepen its expertise in precision flatbed coating technology. Relying on in-house core components, intelligent equipment and engineering capabilities, the company will provide end-to-end solutions encompassing process development, equipment integration and mass production rollout for global advanced manufacturing, and propel large-area functional thin-film manufacturing toward higher precision, greater efficiency and enhanced reliability.